2024-05-29
Chengfeng Technology | Taking advantage of the situation
Semiconductor equipment can be divided into two categories: front-end equipment (wafer fabrication) and back-end equipment (packaging and testing). The front equipment involves silicon wafer processing, lithography, etching, ion implantation, thin film deposition, cleaning, polishing, metallization and other processes, and the corresponding core special equipment includes silicon wafer processing equipment, lithography equipment, etching equipment, cleaning equipment, ion implantation equipment,