2024 Romantic Wuhan Chengfeng Technology Meet You
Release time: 2024-04-29

Chengfeng and you meet in Wuhan


April 9, 2024

Jiufeng Mountain Forum cum

China International Compound Semiconductor

Industry Expo

In Wuhan Optics Valley Technology Exhibition Center

Grand Opening

Let us follow in the footsteps of the small series?Look at the scene style


Wafer multi-function inspection equipment

CFW380

Fab rear segment defect detection

Products Name: Defect Detection Equipment for Rear Section of CFW380-Fab

Application scenario: OQC/post-cutting detection/post-expansion detection

Applicable fields:

1. FAB final quality inspection

2. inspection after wafer dicing/film expansion

3. Support 12 "/8"/6 "wafer

4. Support Taiko/Thin thinning process

5. Support wafer flip function

6. ADC automatic defect classification

Pixel Resolution: 2.4 μm @ 2X

Magnification: 1x/2X/5X

Features: yield control, subtle defect detection

CFW820  

Fab front section defect detection equipment

Product Name: CFW820-Fab front section defect detection equipment

Application Scenario: ADI/AEI/Post CMP/Advanced Packaging/Dicing/0QC

Applicable fields:

1. FAB front-end process control

2. Support 12 "/8"/6 "wafer

3. Support Taiko/Thin thinning process

4. Support wafer flip function

5. ADC automatic defect classification

Pixel Resolution: 976nm @ 5X

Magnification: 2X/5X/10X/20X

Features: AOI, fast screening of large defects

CFW920

Fab front-end process control equipment

Product name: CFW920-Fab front-end process control equipment

Application Scenario: ADI/AEI/Post CMP/Advanced Packaging/Dicing/0QC

Applicable fields:

1. FAB front-end process control

2. Support 12 "/8"/6 "wafer

3. Support Taiko/Thin thinning process

4. Support wafer flip function

5. ADC automatic defect classification

 

Pixel Resolution: 170 nm @ 20X

Magnification: 2X/5X/10X/20X,50X/100X

Features: yield control, subtle defect detection