Chengfeng and you meet in Wuhan
April 9, 2024
Jiufeng Mountain Forum cum
China International Compound Semiconductor
Industry Expo
In Wuhan Optics Valley Technology Exhibition Center
Grand Opening
Let us follow in the footsteps of the small series?Look at the scene style
Wafer multi-function inspection equipment
CFW380
Fab rear segment defect detection
Products Name: Defect Detection Equipment for Rear Section of CFW380-Fab
Application scenario: OQC/post-cutting detection/post-expansion detection
Applicable fields:
1. FAB final quality inspection
2. inspection after wafer dicing/film expansion
3. Support 12 "/8"/6 "wafer
4. Support Taiko/Thin thinning process
5. Support wafer flip function
6. ADC automatic defect classification
Pixel Resolution: 2.4 μm @ 2X
Magnification: 1x/2X/5X
Features: yield control, subtle defect detection
CFW820
Fab front section defect detection equipment
Product Name: CFW820-Fab front section defect detection equipment
Application Scenario: ADI/AEI/Post CMP/Advanced Packaging/Dicing/0QC
Applicable fields:
1. FAB front-end process control
2. Support 12 "/8"/6 "wafer
3. Support Taiko/Thin thinning process
4. Support wafer flip function
5. ADC automatic defect classification
Pixel Resolution: 976nm @ 5X
Magnification: 2X/5X/10X/20X
Features: AOI, fast screening of large defects
CFW920
Fab front-end process control equipment
Product name: CFW920-Fab front-end process control equipment
Application Scenario: ADI/AEI/Post CMP/Advanced Packaging/Dicing/0QC
Applicable fields:
1. FAB front-end process control
2. Support 12 "/8"/6 "wafer
3. Support Taiko/Thin thinning process
4. Support wafer flip function
5. ADC automatic defect classification
Pixel Resolution: 170 nm @ 20X
Magnification: 2X/5X/10X/20X,50X/100X
Features: yield control, subtle defect detection