On January 6, 2023, the Guangdong Provincial Department of Industry and Information Technology released the Notice on the list of small and medium-sized enterprises that will be qualified for review in 2022 and those that will be eligible for review in 2019.

Chengfeng Wafer AOI CF-910 is specially designed for graphic wafer detection. It can detect wafer surface defects including: wafer graphic pattern defects (missing/incomplete/bad size/scratches/foreign bodies, etc.) and random surface defects (broken/dirty/scratches/foreign bodies, etc.).

Chengfeng Wafer AOI CF-910 broke through 200nm-3um level defect detection

From November 17 to 19, the first "World IC Conference" co-sponsored by the Ministry of Industry and Information Technology and Anhui Provincial People's Government was held in Hefei International Convention and Exhibition Center. The conference consists of opening ceremony, Summit for

On the afternoon of November 10th, the Deputy Director Yao Wei, Deputy Director Wang Lidong, Section Chief Tian Tian and other leaders of Zhuhai Bureau of Industry and Information Technology visited Zhuhai Chengfeng Electronic Technology Co., LTD for field visit and discussion.

On the afternoon of April 18, 2022, a delegation from Zhuhai Electronic, Electrical and Machinery Special Equipment Manufacturing Association visited Chengfeng Technology for exchange. Zheng Mingguo, general manager of Chengfeng Technology and Yang Fengjiao, manager of Marketing Department of Chengfeng Technology received them. Accompanied by General Manager Zheng, I visited the production workshop of the company to understand the functional characteristics and detection capabilities of Chengfen

The birth of a chip, Wafer manufacturing and finished chip manufacturing two stages. So how exactly are chips packaged?

Packaging used to be an afterthought in semiconductor manufacturing. You make a little chip, and then you connect it, and you go on your happy way. But as Moore's Law stretched, engineers realized they could use all parts of a chip, including packaging, to make the best products. Improved packaging gives you significant benefits because there are thicker sheets of metal for better conductivity, and the I/O (input/output) problem is still one of the biggest problems facing semiconductors.

Machine vision application of 8 lighting skills: Tip 1: Detect material defects -- high brightness light;

Sensitivity to light: CCD sensor is more sensitive to light than CMOS sensor;Low contrast adaptability: CCD sensor is more suitable for low contrast than CMOS sensor;Image transmission speed: CMOS sensor can obtain higher image transmission speed, more suitable for the needs of high-speed occasions;

IP (IngressProtection) protection level is a special industrial protection level, to the electrical equipment and packaging dust, waterproof and anti-collision degree to classify the product method, this system is drafted by IEC, and published in IEC529.

One can automatically measure the appearance size of products, two can measure multiple sizes at the same time, three for small size can be accurate measurement, four has higher continuity and precision, can improve the real-time performance and accuracy of industrial online measurement.