Chengfeng Wafer AOI CF-910 is specially designed for graphic wafer detection. It can detect wafer surface defects including: wafer graphic pattern defects (missing/incomplete/bad size/scratches/foreign bodies, etc.) and random surface defects (broken/dirty/scratches/foreign bodies, etc.).
The software adopts the mature algorithm combining Chengfeng Technology AI and traditional vision, which can detect the appearance defects of wafer with high precision and greatly reduce the false positives of defects.
Is the industry's first AI fast training and modeling, fast acceptance function, traditional vision +AI, high precision/efficient landing, to overcome foreign "neck pinch" technology difficulties, the implementation of domestic replacement.
Specific parameter | SPEC |
Equipment specification | 1350*2600*2000mm |
Detection accuracy | 200nm~3um |
Camera configuration | 25 million +12 million high speed industrial cameras |
Detection time | Single chip (8mm*5mm) : <=0.5 seconds |
Omission rate | <=0.01% (0 missed detection can be achieved for serious defects) |
Breakthrough defect detection at 500nm-1μm level |
Scope of application
Optical inspection and calibration of graphic patterns in various wafer manufacturing processes
Wafer end of shipment quality inspection
Closed test manufacturing defect detection after segmentation and segmentation