CFW820 is an optical inspection equipment used for defect monitoring on FAB production lines. It can benchmark against the Eagle series machines of foreign competitors Camxxxx and can be applied to multiple process stations such as ADI/AEI/CMP/OQC. It can help customers quickly screen typical graphic defects and surface defects that affect product quality on the production line, ensuring stable operation of various processes.

CFW820 has ultra-high wafer transmission compatibility, compatible with Thin/Taiko/Standard wafers, configured with multiple optical magnifications, and has dual channel detection capability, which can balance sensitivity and throughput. Combined with flexible and easy-to-use recipe management function, based on deep learning ADC algorithm, it helps customers' production lines run stably.

5 in 1 function

Crystal surface detection	Back inspection	edge detection	Warpage measurement	Thickness measurement

CFW920 is an optical inspection equipment used for FAB front-end process control, applied in multiple process stations such as ADI/AEI/CMP, to help customers discover key graphic defects that affect yield during the process development and production capacity improvement stages, and improve yield. CFW920 has a defect sensitivity of up to 200nm, dual channel detection throughput, flexible and easy-to-use recipe management function, and deep learning based ADC algorithm, helping customers quickly enter the HVM stage of their production line.

CFW821 is a high specification FAB front-end graphic inspection equipment that can benchmark the 89xx machine of foreign competitor Kxx. It is equipped with dual TDI sensors, which can achieve synchronous imaging of bright and dark fields. One scan can simultaneously capture images of both bright and dark fields, and can scan and detect more defects. It is suitable for multiple process stations such as ADI/AEI/CMP of FAB front-end, and can help customers quickly screen typical graphic defects and surface defects that affect product quality on the production line, ensuring stable operation of various processes.

It can meet applications with high throughput and high defect detection rate.

CFW921 is a high specification FAB front-end nano pattern detection device that can benchmark against foreign competitors Kxx machines. It is equipped with dual TDI sensors, which can achieve synchronous imaging of bright and dark fields. One scan can simultaneously capture and detect images of both bright and dark fields, and can scan and detect more defects. It is suitable for multiple process stations such as ADI/AEI/CMP in FAB front-end.

It can meet the application scenarios of high sensitivity and high detection rate of defects.

CFW830 can achieve fully automatic wafer thickness Bow、 Stress, warpage TTV、 Flatness Roughness measurement, equipped with a reversible robotic arm, can achieve measurement of crystal surface and crystal back.

CFW510 is a high-performance, high-resolution infrared penetration measurement microscope that supports silicon-based wafers and 6-inch/8-inch/12 inch wafers. It is equipped with an industrial computer/image display and measurement software, and features an integrated design.

CFW520 is a high-performance, high-resolution fully automatic infrared penetration lithography (OVL) measurement device that supports silicon-based wafers and 6-inch/8-inch/12 inch wafers. The device is equipped with a load/unload module, autofocus module, and automatic measurement software.