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CFW820 is an optical inspection equipment used for defect monitoring on FAB production lines. It can benchmark against the Eagle series machines of foreign competitors Camxxxx and can be applied to multiple process stations such as ADI/AEI/CMP/OQC. It can help customers quickly screen typical graphic defects and surface defects that affect product quality on the production line, ensuring stable operation of various processes.
CFW820 has ultra-high wafer transmission compatibility, compatible with Thin/Taiko/Standard wafers, configured with multiple optical magnifications, and has dual channel detection capability, which can balance sensitivity and throughput. Combined with flexible and easy-to-use recipe management function, based on deep learning ADC algorithm, it helps customers' production lines run stably.
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| Crystal surface detection | Back inspection | edge detection | Warpage measurement | Thickness measurement |
CFW820 | |
Application scenarios | ADI/AEI/Post CMP/OQC |
Wafer size | √ Supports 12 "/8"/6 "wafers |
√ 12 inch sheet support: Taiko wafer center thickness up to 75um | |
√ 12 inch Thin wafer thin to 130um | |
Equipment functions (Ultra high compatibility) | √ Compatible with Taiko/Yin/Standard wafer |
Support various thinning processes | |
√ Bernoulli fork supports flipping function (optional) | |
√ Throughput and sensitivity benchmarking foreign competitors - dual channel detection | |
√ ADC automatic defect classification - based on deep learning | |
Equipment features | Quick screening for major defects |
Specific parameters/specifications | √ Sensor: CCD |
√ Optical path: Light dark field composite | |
√ Objective magnification: 1X/2X/5X | |
√ Resolution (BF): 1.3um | |
√ WPH：100 | |