Optical quantity detection equipment for wafer packaging testing series

Zhuhai Chengfeng Electronic Technology Co., Ltd. was established in 2015, headquartered in Zhuhai. The company has set up branches and offices in Suzhou, Hefei, Shanghai, Beijing, Shenzhen, Chengdu, Wuhan, Changsha, Thailand, Singapore and other domestic and foreign places.

Chengfeng Technology focuses on the research and development, production, and sales of semiconductor optical detection equipment, with completely independent intellectual property rights. Currently, it has mastered multiple sets of optical microscopy imaging technologies, and has accumulated years of core graphic detection algorithms such as D2B/D2D/GDD in the full stack. It has launched multiple mass production models in the fields of wafer manufacturing and mask manufacturing, providing comprehensive support for process monitoring and yield improvement in the semiconductor industry.


Interested in or having questions about this product?

Grain six sided inspection equipment (Wafer to wafer) CF910-C
Optical quantity detection equipment for wafer packaging testing series

CF910-C is a high-end grain six sided inspection equipment that can support a minimum grain size of 0.2mm, Loading supports 6/8/inch UV film, unloading supports UV film/waffle box, using Chengfeng's self-developed bright and dark field light source and autofocus imaging system, which can achieve an image resolution of up to 1um and detect small cracks up to 3um.

It can support products such as silicon capacitors/chip chips.


CF910-C

Specific parameters/specifications

√ Grain size: 0.17mm~3mm

√ Loading: 6-inch/8-inch UV film

Cutting mode: waffle box/UV film

√ Resolution: 1um (six sided full inspection)

√ Minimum detectable crack: 3um

√ UPH:  2k (data for 0.25mm grains)

Interested in or having questions about this product?

High speed grain flipping equipment CF971
Optical quantity detection equipment for wafer packaging testing series

CF971 is a high-speed and high-precision grain flipping device that can support a minimum grain size of 0.3mm. It supports 6/8-inch UV film loading and UV film/Gelpak box unloading, and can flip grains at 90 degrees/180 degrees/270 degrees.

It can support products such as silicon capacitors/chip chips, and has a significantly leading UPH production capacity in the industry.


CF971

Specific parameters/specifications

√ Grain size: 0.3mm~5mm

√ Loading: 6-inch/8-inch UV film

Cutting mode: Gelpak box/UV film

Cutting accuracy: plus or minus 25 microns

√ UPH:  2k (data for 0.3mm grains)

1