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Optical quantity detection equipment for wafer manufacturing series Mask template manufacturing optical quantity detection equipment series Optical quantity detection equipment for wafer packaging testing series Passive components and lead frame AOI series

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Wafer geometry measurement equipment CFW830

CFW830 can achieve fully automatic wafer thickness Bow、 Stress, warpage TTV、 Flatness Roughness measurement, equipped with a reversible robotic arm, can achieve measurement of crystal surface and crystal back.


CFW830

Specific parameters/specifications

√ Function: Thickness Bow、 Stress, warpage TTV、 Flatness and roughness measurement