Specific parameters/specifications

√ Grain size: 0.17mm~3mm

√ Loading: 6-inch/8-inch UV film

Cutting mode: waffle box/UV film

√ Resolution: 1um (six sided full inspection)

√ Minimum detectable crack: 3um

√ UPH:  2k (data for 0.25mm grains)

√ Supports 6-inch / 8-inch / 12 inch Wafer / Frame / Expansion Ring

√ Microscopic imaging optical path (2X/5X/10X)

√ Maximum pixel resolution: 0.34um

√ High speed and high-precision autofocus module

√ PIC/PD/LENS dedicated AOI

√ Damaged / Scratched / Dirtied / Foreign Object / Cracked / Oxidized / Bent / Defective Optical Port / Defective Waveguide

√ Load/Unload: 6-inch expansion ring/Gelpak box

√ Front microscopic imaging optical path (5X/10X)

√ Side telecentric lens optical path (4X)

√ Maximum pixel resolution: 0.34um

√ High speed and high-precision autofocus module

√ LD front/side defects, SM area defects, gold wire welding defects, etc

√ 2D + 3D

√ 2D resolution: 3um/pixel

√ 3D resolution: XY: 1um, Z: 4um

√ Full inspection of gold wire/pad/gold ball

√ Equipped with independent re evaluation software and computer

√ UPH：800

√ Missing golden balls, multiple goals, etc

√ Gold wire empty welding, solder leakage, excessive welding, warping, collapse of wire, etc

√ Pad with multiple solder joints, no grains, poor solder pads, poor silver paste, etc

√ TIA/PD/PIC/COC full detection

√ Wafer Inspection Specialized Microscopic Imaging Module (2X/5X/10X)

√ Maximum pixel resolution: 0.34um

√ High speed and high-precision autofocus module

√ Equipped with independent re evaluation software and computer

√ UPH：160

√ TIA: Cracks/damages/scratches/dents/silver glue, etc

√ PD: Damaged/dirty/scratched, etc

√ PIC: Damaged/dirty/scratched/crushed, etc

√ COC: cracks/damages/scratches/dents/dirt, etc

√ 2D+3D

√ 2D resolution: 10um/pixel

√ 3D resolution: XY: 13um, Z: 0.4um

√ Full inspection of components/boards/gold fingers

√ Equipped with independent re evaluation software and computer

√ UPH：300

√ Components: missing/damaged/raised/tinned, etc

√ Golden Fingers: Scratches/dents/exposed copper/missing, etc

√ Board: damaged/abnormal wiring, etc

√ 2D+3D

√ Number of 2D cameras: 15 (resolution: 3um/pixel)

√ Number of 3D cameras: 2 (XY: 8um, Z: 0.2um)

√ Detectable content: Full inspection of 6 surfaces/gold fingers/labels

√ Equipped with independent re evaluation software and computer

√ UPH：300

√ Damage/scratch/dirt/foreign matter/exposed copper/oxidation/deformation/protrusion/depression, etc

√ Label printing deviation/scratches/contamination, etc

√ 2D+3D

√ Number of 2D cameras: 2 (resolution: 3um/pixel)

√ Number of 3D cameras: 1 (XY: 8um, Z: 0.2um)

√ Testing content: All areas of COB substrate

√ Equipped with independent re evaluation software and computer

√ UPH：300

√ 2D: Foreign objects/exposed copper/scratches/dents/color differences/dirt, etc

√ 3D: protrusions/poor height of copper particles, etc

√ Detection content: Optical port/waveguide/Pad area

√ Specialized Microscopic Imaging Module (5X)

√ Maximum pixel resolution: 0.68um

√ High speed and high-precision autofocus module

√ Equipped with independent re evaluation software and computer

√ UPH：300

√ Optical port: damaged/scratched/crushed/dirty, etc

√ Waveguides: Scratches/dents/dirt/foreign objects, etc

√ Pad area: damaged/scratched/crushed/dirty, etc