√ 2D + 3D

√ 2D resolution: 3um/pixel

√ 3D resolution: XY: 1um, Z: 4um

√ Full inspection of gold wire/pad/gold ball

√ Equipped with independent re evaluation software and computer

√ UPH：800

√ Missing golden balls, multiple goals, etc

√ Gold wire empty welding, solder leakage, excessive welding, warping, collapse of wire, etc

√ Pad with multiple solder joints, no grains, poor solder pads, poor silver paste, etc