√ TIA/PD/PIC/COC full detection

√ Wafer Inspection Specialized Microscopic Imaging Module (2X/5X/10X)

√ Maximum pixel resolution: 0.34um

√ High speed and high-precision autofocus module

√ Equipped with independent re evaluation software and computer

√ UPH：160

√ TIA: Cracks/damages/scratches/dents/silver glue, etc

√ PD: Damaged/dirty/scratched, etc

√ PIC: Damaged/dirty/scratched/crushed, etc

√ COC: cracks/damages/scratches/dents/dirt, etc