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CF910-D Wafer Double-Side Inspection Equipment
SpecificationsDetectable Defects

√ Supports 6-inch / 8-inch / 12 inch Wafer / Frame / Expansion Ring

√ Microscopic imaging optical path (2X/5X/10X)

√ Maximum pixel resolution: 0.34um

√ High speed and high-precision autofocus module

√ PIC/PD/LENS dedicated AOI

√ Damaged / Scratched / Dirtied / Foreign Object / Cracked / Oxidized / Bent / Defective Optical Port / Defective Waveguide